SEMI-e 2024 | Suzhou Lieqi made a wonderful appearance at the Shenzhen International Semiconductor Exhibition!

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From June 26 to June 28, Suzhou Lieqi Intelligent Equipment Co., Ltd. appeared at `SEMI-e 2024`, attracting many industry insiders to visit, exchange ideas and discuss business cooperation.

SEMI-e 2024

From June 26 to June 28, Suzhou Lieqi Intelligent Equipment Co., Ltd. ("Suzhou Lieqi" for short) brought LQ-VADB30 real-time alignment and placement equipment, HS-LDTS2000 LD chip test equipment (normal temperature & high temperature), HS-DB2000 fully automatic high-speed and high-precision placement equipment and other semiconductor automation packaging and semiconductor testing products to "SEMI-e 2024", attracting many industry insiders to visit, communicate and negotiate business cooperation.

Exhibited products are hotly watched Exhibited products are hotly watched

The LQ-VADB30 real-time alignment of placement machine featured at this exhibition provides a highly reliable automated solution for the EML/VCSEL/SiP high-speed optical chip array mounting of the latest 800G/1.6T optical modules with a product mounting accuracy of more than 99.5% ±3um. It can also be customized according to the user's specific application scenarios to meet the customer's mass production and R&D needs, attracting the attention of countless visitors on site;

HS-LDTS2000LD is a device for photoelectric performance testing of LD chips (BAR bars). It can test the LIV parameters and spectral parameters of the front light and back light of the long-wavelength laser BAR bar under normal and high temperature conditions. The equipment has a high degree of automation and intelligent image algorithm. It supports front and end AOI appearance inspection & OCR character recognition, which is conducive to manufacturers to improve test efficiency and improve product quality control;

HS-DB2000 is a fully automatic high-speed and high-precision patch equipment with the function of silver glue patch. It is a patch equipment developed for multi-component module patch process. This equipment has dispensing, dipping, and a freely adjustable width conveying system. Users can choose the appropriate solution according to the specific application, which has become one of the highlights of the exhibition.

On-site communication and cooperation

Not only that, Suzhou Lieqi also displayed the "miniature water jet guided laser cutting system", whose core components have been replaced by domestic products, winning wide attention. Technical experts were arranged on site to explain on site, and the exhibitors experienced the charm of these innovative technologies in person and exchanged experiences with industry experts. This exhibition is not only a display of technology, but also a platform for industry exchanges and cooperation, injecting new vitality into the development of the semiconductor industry.

Suzhou Lieqi has always attached importance to independent research and development and technological innovation, and is committed to continuously improving and enhancing the process level. Under the strategic guidance of "domestic substitution", the company continues to launch various innovative equipment to create value for customers and contribute to the development of domestic technology.

The exhibition ended successfully, and the future of semiconductors is promising!

The exhibition ended smoothly, and we saw continuous breakthroughs and innovations in the field of semiconductor packaging and testing. Suzhou Lieqi will continue to explore and move forward in the semiconductor field with full harvest and create more value for customers!

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